IEEE ICDE 2022 Call for Industry and Applications Track
The IEEE International Conference on Data Engineering (ICDE) 2022 Industry and Applications Track will feature high-quality submissions describing innovation in all areas of data management systems as well as innovative and demanding application scenarios.
Topics of Interest
The track will emphasize submissions that describe innovative industrial advancements in relevant areas including (but not limited to):
Database and data management systems
Cloud systems
Data systems on new hardware
Scalable machine learning and data mining systems
Data quality and cleaning
Mobile data management
Stream data processing and IoT
Information retrieval
Knowledge discovery
Information integration
Information integrity
Submissions that do not articulate the innovative aspect of a product or application project (including relevant open-source software), but rather give a general overview or address a pure research problem, are discouraged.
The Industry Track will accept short (6 pages + unlimited space for references) as well as long (12 pages + unlimited space for references) submissions.
Important Dates
Industry and applications track have only one round of submissions.
All deadlines are 11:59PM Anywhere on Earth (AoE).
Submission due: November 30, 2021 (Tuesday) updated to December 17, 2021 (Friday)
Notification for authors (Accept/Revise/Reject): January 20, 2022 (Thursday) updated to January 31, 2022 (Monday)
Revision due: March 4, 2022 (Friday)
Notification to authors (Accept/Reject): March 20, 2022 (Sunday)
Camera-ready copy due: March 30, 2022 (Wednesday)
Submission Guidelines
Manuscripts must be prepared in accordance with the IEEE format and submitted to the CMT Industry track:
Long papers must not exceed 12 pages +unlimited space for references and short papers must not exceed 6 pages + unlimited space for references. Only electronic submissions in PDF format will be considered.
A paper submitted to ICDE 2022 cannot be under review for any other conference or journal during the entire time it is considered for ICDE 2022, and it must be substantially different from any previously published work.
Submissions are reviewed in a single-blind manner.
All accepted papers will appear in the proceedings. The best papers will be selected for extended versions to be published in the IEEE Transactions on Knowledge and Data Engineering. IEEE reserves the right to exclude a paper from distribution after the conference (e.g., removal from IEEE Xplore) if none of the authors attends the conference to present their paper.
Industry and Applications Chairs
Guoliang Li, Tsinghua University, China
Ippokratis Pandis, Amazon
Cong Yu, Google
Program Committe Members
Wasay Abdul, Harvard University, USA
Zhifeng Bao, RMIT University, Australia
Senjuti Basu Roy, New Jersey Institute of Technology, USA
Mustafa Canim, IBM Research
Lei Cao, MIT, USA
Chengliang Chai, Tsinghua University, China
Qun Chen, Northwestern Polytechnical University, China
Dong Deng, Rutgers University – New Brunswick, USA
Avrilia Floratou, Microsoft
Tingjian Ge, University of Massachusetts, Lowell, USA
Ronen Grosman, Huawei
Anja Gruenheid, Microsoft
Xiaotao Gu, University of Illinois Urbana-Champaign, USA
Yu Gu, Northeastern University, China
Shuang Hao, Beijing Jiaotong University, China
Yeye He, Microsoft Research
Silu Huang, Microsoft Research
Alekh Jindal, Keebo
Kiran Kate, IBM Research
Hariharan Lakshmanan, Oracle, USA
Nikolay Laptev, Facebook
Mengxing Liu, Huawei
Yi Lu, MIT, USA
Thorsten Papenbrock, Hasso Plattner Institute
Dhaval Patel, IBM Research
Lukas Rupprecht, IBM Research – Almaden
Jingbo Shang, University of California, San Diego, USA
Wei Shen, Nankai University, China
Alkis Simitsis, Athena Research Center
Yannis Sismanis, Databricks
Nan Tang, Qatar Computing Research Institute, HBKU
Sandeep Tata, Google, USA
Yongxin Tong, Beihang University, China
Hongzhi Wang, Harbin Institute of Technology, China
Jianguo Wang, Purdue University, USA
Tianzheng Wang, Simon Fraser University, Canada
You Wu, Google
Jianliang Xu, Hong Kong Baptist University, Hong Kong
Xiangyao Yu, University of Wisconsin-Madison, USA
Xiaohui Yu, Shandong University, China
Kai Zeng, Alibaba Group
Dongxiang Zhang, Zhejiang University, China
Wei Zhang, East China Normal University, China
Erkang Zhu, Microsoft Research
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We are excited to see you at ICDE 2022